Experimental investigation for thermal performance enhancement of various heat sinks using Al2O3 NePCM for cooling of electronic devices

Abstract

Electronic devices are being used extensively for different applications, where the thermal management of these devices is still a critical challenge due to rapid miniaturization, high heat flux and constantly rising temperature. Phase change materials (PCMs) based thermal management is adopted, but the low thermal conductivity limits their use in temperature-controlled electronic devices. Nano-enhanced phase change materials (NePCMs) can advance the heat transfer rate (HTr), decrease the temperature, and increase the operating time of the electronic device. The present study compares the thermal performances (TP) of three different heat sinks (simple, circular pin finned and copper foam) with NePCM (RT54HC/Al2O3) and varying Al2O3 nanoparticles concentrations (0.15–0.25 wt%) and heat fluxes (0.98–2.94 kW/m2) to optimize the overall device performance. The results show that at a heat flux (HF) of 0.98 kW/m2 and 0.25 wt% of Al2O3 nanoparticles (NPs), the base temperature of simple, circular pin finned and Cu foam heat sink was reduced by 21.3%, 25.03%, and 36.2%, respectively. The Cu foam heat sink (HS) has exceptional TP than the HSs without Cu foam. Accordingly, NePCMs are highly recommended in electronic devices for an optimized thermal management system.

Publication DOI: https://doi.org/10.1016/j.csite.2022.102553
Divisions: College of Engineering & Physical Sciences > School of Engineering and Technology > Mechanical, Biomedical & Design
Funding Information: The authors are thankful to the University of Engineering and Technology Lahore for funding through grant No: ORIC/110-ASRB/1641 to execute the current research work.
Additional Information: Copyright © 2022, The Authors. Published by Elsevier Ltd. This is an open access article under the CC BY-NC-ND license (https://creativecommons.org/licenses/by-nc-nd/4.0/).
Uncontrolled Keywords: Al O,Circular pin-finned,Cu foam,RT-54HC (PCM),Thermal management,Engineering (miscellaneous),Fluid Flow and Transfer Processes
Publication ISSN: 2214-157X
Last Modified: 07 Oct 2024 07:43
Date Deposited: 26 Jan 2023 18:06
Full Text Link:
Related URLs: https://www.sci ... 214157X22007900 (Publisher URL)
http://www.scop ... tnerID=8YFLogxK (Scopus URL)
PURE Output Type: Article
Published Date: 2023-01
Published Online Date: 2022-11-22
Accepted Date: 2022-11-10
Authors: Zahid, Imran
Farhan, M.
Farooq, M.
Asim, M.
Imran, M. (ORCID Profile 0000-0002-3057-1301)

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