Anodic dissolution growth of metal-organic framework HKUST-1 monitored:Via in situ electrochemical atomic force microscopy

Abstract

In situ electrochemical atomic force microscopy (ec-AFM) is utilised for the first time to probe the initial stages of metal-organic framework (MOF) coating growth via anodic dissolution. Using the example of the Cu MOF HKUST-1, real time surface analysis is obtained that supports and verifies many of the reaction steps in a previously proposed mechanism for this type of coating growth. No evidence is observed however for the presence or formation of Cu2O, which has previously been suggested to be both key for the formation of the coating and a potential explanation for the anomalously high adhesion strength of coatings obtained via this methodology. Supporting in situ electrochemical Raman spectroscopy also fails to detect the presence of any significant amount of Cu2O before or during the coating's growth process.

Publication DOI: https://doi.org/10.1039/c8ce00761f
Divisions: College of Engineering & Physical Sciences > School of Infrastructure and Sustainable Engineering > Chemical Engineering & Applied Chemistry
College of Engineering & Physical Sciences
Funding Information: SDW would like to thank Dr Hollie Patten, Dr Deborah Lomax and Shiyu Xu for advice and training on the use of and data analysis from the in situ ec-AFM set up. SDW would like to thank the NoWNANO DTC and EPSRC for funding.
Additional Information: © The Royal Society of Chemistry 2018
Uncontrolled Keywords: General Chemistry,General Materials Science,Condensed Matter Physics
Publication ISSN: 1466-8033
Last Modified: 31 Oct 2024 08:32
Date Deposited: 20 Aug 2019 09:28
Full Text Link: https://www.res ... 756f0e8eb).html
Related URLs: http://www.scop ... tnerID=8YFLogxK (Scopus URL)
https://pubs.rs ... 1F#!divAbstract (Publisher URL)
PURE Output Type: Article
Published Date: 2018-06-25
Accepted Date: 2018-06-22
Authors: Worrall, Stephen D. (ORCID Profile 0000-0003-1969-3671)
Bissett, Mark A.
Attfield, Martin P.
Dryfe, Robert A.W.

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