Strengthening mechanisms in nanostructured copper/304 stainless steel multilayers

Zhang, X., Misra, A., Wang, H., Shen, T.D., Swadener, J.G., Embury, J.D., Kung, H., Hoagland, R.G. and Nastasi, M. (2003). Strengthening mechanisms in nanostructured copper/304 stainless steel multilayers. Journal of Materials Research, 18 (7), pp. 1600-1606.

Abstract

Nanostructured Cu/304 stainless steel (SS) multilayers were prepared by magnetron sputtering. 304SS has a face-centered-cubic (fcc) structure in bulk. However, in the Cu/304SS multilayers, the 304SS layers exhibit the fcc structure for layer thickness of =5 nm in epitaxy with the neighboring fcc Cu. For 304SS layer thickness larger than 5 nm, body-centered-cubic (bcc) 304SS grains grow on top of the initial 5 nm fcc SS with the Kurdjumov-Sachs orientation relationship between bcc and fcc SS grains. The maximum hardness of Cu/304SS multilayers is about 5.5 GPa (factor of two enhancement compared to rule-of-mixtures hardness) at a layer thickness of 5 nm. Below 5 nm, hardness decreases with decreasing layer thickness. The peak hardness of fcc/fcc Cu/304SS multilayer is greater than that of Cu/Ni, even though the lattice-parameter mismatch between Cu and Ni is five times greater than that between Cu and 304SS. This result may primarily be attributed to the higher interface barrier stress for single-dislocation transmission across the {111} twinned interfaces in Cu/304SS as compared to the {100} interfaces in Cu/Ni.

Divisions: Engineering & Applied Sciences > Mechanical engineering & design
Engineering & Applied Sciences
Additional Information: Copyright 2008 Elsevier B.V., All rights reserved.
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Related URLs: http://www.scopus.com/inward/record.url?scp=0043202894&partnerID=8YFLogxK (Scopus URL)
Published Date: 2003-07
Authors: Zhang, X.
Misra, A.
Wang, H.
Shen, T.D.
Swadener, J.G. ( 0000-0001-5493-3461)
Embury, J.D.
Kung, H.
Hoagland, R.G.
Nastasi, M.

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