Thermal stability of sputter-deposited 330 austenitic stainless-steel thin films with nanoscale growth twins

Zhang, X., Misra, A., Wang, H., Swadener, J.G., Lima, A.L., Hundley, M.F. and Hoagland, R.G. (2005). Thermal stability of sputter-deposited 330 austenitic stainless-steel thin films with nanoscale growth twins. Applied Physics Letters, 87 (23),

Abstract

We have explored the thermal stability of nanoscale growth twins in sputter-deposited 330 stainless-steel (SS) films by vacuum annealing up to 500 °C. In spite of an average twin spacing of only 4 nm in the as-deposited films, no detectable variation in the twin spacing or orientation of twin interfaces was observed after annealing. An increase in the average columnar grain size was observed after annealing. The hardness of 330 SS films increases after annealing, from 7 GPa for as-deposited films to around 8 GPa for annealed films, while the electrical resistivity decreases slightly after annealing. The changes in mechanical and electrical properties after annealing are interpreted in terms of the corresponding changes in the residual stress and microstructure of the films.

Publication DOI: https://doi.org/10.1063/1.2135871
Divisions: Engineering & Applied Sciences > Mechanical engineering & design
Engineering & Applied Sciences
Additional Information: © 2005 American Institute of Physics.Thermal stability of sputter-deposited 330 austenitic stainless-steel thin films with nanoscale growth twins Appl. Phys. Lett. 87, 233116 (2005)
Uncontrolled Keywords: nanoscale growth twins,orientations,twin interfaces,vacuum annealing,electric conductivity,residual stresses,sputter deposition,thermodynamic stability
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Related URLs: http://www.scopus.com/inward/record.url?scp=28444435107&partnerID=8YFLogxK (Scopus URL)
http://scitation.aip.org/content/aip/journal/apl/87/23/10.1063/1.2135871 (Publisher URL)
Published Date: 2005-12-05
Authors: Zhang, X.
Misra, A.
Wang, H.
Swadener, J.G. ( 0000-0001-5493-3461)
Lima, A.L.
Hundley, M.F.
Hoagland, R.G.

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